Volume 2310: Proceedings of the International Conference on Physical Mesomechanics. Materials with Multilevel Hierarchical Structure and Intelligent Manufacturing Technology
Volume 2310: Proceedings of the International Conference on Physical Mesomechanics. Materials with Multilevel Hierarchical Structure and Intelligent Manufacturing Technology
By Victor E. Panin and Vasily M. Fomin
Volume 2310 is the proceedings of International Conference on Physical Mesomechanics. Materials with Multilevel Hierarchical Structure and Intelligent Manufacturing Technology (5–9 October 2020, Tomsk, Russia)
Title information
Summary of this volume: The International Conference on Physical Mesomechanics. Materials with Multilevel Hierarchical Structure and Intelligent Manufacturing Technology-2020 is a follow-up to the conferences on physical mesomechanics, which has been held since 1996. The current strategy of materials science development is based on a multiscale interdisciplinary approach, which combines experimental and theoretical studies as well as computer modeling and design at different scales. This new paradigm is integrated into the methodology of mechanics, physics, chemistry, informatics, life sciences, geology, and other branches. Modern industrial and engineering applications require that the multiscale (hierarchical) organization of materials, structures, and systems of different origin must be taken into account. In fact, the material must be considered today as an individual structural level of a product or a structure. This enables an efficient exploitation of new opportunities offered by modern manufacturing technologies.
These proceedings will be of interest to: Students, PhD student, researchers and lecturers both from academia and industry who are involved in the study of material behavior under loading as well as materials design, treatment and processing.
For further information about this volume: Please view the table of contents available on AIP Publishing's Scitation platform: Volume 2310 table of contents.